FCI’s core team of product engineers hold extensive experience in custom package design and support. We deliver a robust designs, efficient prototyping and a smooth transfer to manufacture service. To receive more information on how to get started with FlipChip International, fill out the Contact Us form and one of FCI’s knowledgeable Sales team members will provide the information and technical guidance necessary to allow you to make a seamless transition into the world of wafer bumping.

FCI’s Sales team will be able to provide you with FlipChip International’s Bumping Design Guide. This Design Guide will help you decide which bumping process offering is best for your device. This comprehensive design guide includes the basics of each process flow, incoming wafer requirements, device requirements, and material properties, so you may have a better understanding of the FCI bumping process as a whole. FCI’s Sales team will be glad to let you know which process will work best for you; click here to contact your regional Sales Rep. FCI is a development driven engineering organization and we are experts at matching up a standard (or custom) bumping process flow to completely match your needs.

The Mask Design Information Form (MDIF) is an easy to use Excel file that lets you tell FlipChip about your bumping requirements, your dicing requirements, your packaging requirements, and any other special processing requirements that you may have. Please contact FCI’s Sales team at the above Getting Started link to obtain a copy of the MDIF. Our Sales team will be happy to guide you through the completion of this form and walk you through the process of wafer bumping.