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• Bumping Design Options
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    • Electroplated Cu EDC™(various offerings)
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  • Bump Heights ≤ 130um
    • SFC - Bump on I/O
    • SFC - Repassivation (Spheron™ or BCB)
    • SFC - Redistributions (Spheron™ or BCB)
    • Cu Pillar Bump - Repassivation (Spheron™ )
    • EliteFC™ - Electroless Ni/Au
  • Bump Heights ≥ 160um
    • Spheron™ WLCSP - Bump on I/O
    • Spheron™ WLCSP - Redistribution
    • Electroplated Cu Spheron™ WLCSP
    • UltraCSP® WLCSP - Bump on I/O
    • UltraCSP® WLCSP - Redistribution
    • EliteCSP™ - Electroless Ni/Au
• Getting Started with FCI
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Site Map

• About Us
• Company
• Mission Statement
• “Quality and Registrations”
• Licensing
• Rosestreet Labs

• Services
• Design
• Bump
• Probe
• Die Sales
• Analytic

• Bumping Design Options
• Non-Solder Bumped Options
• Electroplated Cu EDC™(various offerings)
• EliteUBM™ -Electroless Ni/AU

• Bump Heights ≤ 130um
• SFC - Bump on I/O
• SFC - Repassivation (Spheron™ or BCB)
• SFC - Redistributions (Spheron™ or BCB)
• Cu Pillar Bump - Repassivation (Spheron™ )
• EliteFC™ - Electroless Ni/Au

• Bump Heights ≥ 160um
• Spheron™ WLCSP - Bump on I/O
• Spheron™ WLCSP - Redistribution
• Electroplated Cu Spheron™ WLCSP
• UltraCSP® WLCSP - Bump on I/O
• UltraCSP® WLCSP - Redistribution
• EliteCSP™ - Electroless Ni/Au

• Getting Started with FCI

• News/Events

• Contact Us
• Location
• Sales Team
• Careers

• Privacy Policy
• Site Map

• Home
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• Contact Us