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Wafer Level ServicesFlipChip International is the leading provider of merchant Wafer Level Packaging (WLP) and flip chip bumping to the semiconductor market through its Phoenix Arizona facility and six global licensees. Services provided include: Standard Flip Chip (SFC, formally known as Flex-on-Cap™), Redistributed SFC, Wafer UltraCSP™, Spheron™ (High Frequency RF Packaging), EliteCSP™ (a low cost E-less Nickel bumping WLCSP), and Polymer Collar™. FlipChip provides turn-key wafer bumping services from engineering prototypes to high volume manufacturing. |
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