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Die Level Services“Transforming Wafers into Known Good Packages”FlipChip International's Die Sales Division has been providing post Fabrication services to the Semiconductor and High Technology industries for over Five Years. We are able to handle both large and small volumes of product in a time sensitive manner. Whether you need your product Probed for electrical test, Wafers thinned, Dicing, Optical Inspection, Packaging or the product Ship Direct to your end customer, we are able to support you. All of our processes are operated in a clean room, with all operators in full bunny suits. We monitor all our processes to insure that the operation is conducted right the first time and every time. Please review our site and give us a call to discuss your unique requirements. |
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