The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science , technology and education in an environment of ...
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science , technology and education in an environment of ...
SEMICON West connects the entire extended electronics supply chain, all in one place and at one time. It’s where the industry gets a glimpse at what’s next and finds its innovation engines. And, it’s the premier place to reconnect with customers an...
The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). ...
Tianshui Huatian Technology Co., Ltd. announced the announcement of No. 2018-031 in Juchao Information, and announced that it has acquired UNISEM, a world-renowned Malaysian semiconductor packaging...
In July 2018, Huatian Technology announced a three-phase development plan for an IC packaging and testing plant in Nanjing. This circuit advanced packaging and testing industry base project will ...
FlipChip International – (FCI), the global technology leader in flip chip bumping and Wafer-Level Packaging, will be returning and exhibiting at the International Wafer-Level Packaging Conference (IWLPC) in San Jose, California...
Tianshui Huatian Technology Company Ltd (TSHT) announced the completion of the acquisition of FlipChip International LLC (FCI) on April 1, 2015. TSHT is the second largest Chinese provider of IC Testing and Packaging for semiconductor IC and components,...
Today TianShui Huatian Technology Co., LTD (TSHT – 002185:Shenzhen) announced to the Shenzhen Stock Exchange their intention to acquire 100% of FlipChip International LLC and its subsidiaries. A binding Letter Of Intent has been ...