Licensing

In 2005 over 1 million wafers will be bumped with FCI's technology worldwide.

FCI has successfully licensed bumping technology to all major IC assembly and test foundries.
- Advanced Semiconductor Engineering (ASE) — Taiwan Foundry
- Amkor Technology (Amkor) — Korean Foundry
- National Semiconductor (NSC) — Multi-national Integrated Device Manufacturer
- Siliconware (SPIL) — Taiwan Foundry
- STATS ChipPAC — Singapore Foundry
Licensing has enabled global implementation of FCI's technology to support wafer fab, test, and IC assembly in local markets.
An FCI technology license provides for a significant "time to market" advantage over other technologies available to your company.
FCI's proven lead free solutions are available for immediate implementation with a technology license. FCI's lead free technology utilizes the industry accepted SAC alloy (SnAgCu) in both SFC and UltraCSP technologies.

SFC (Standard Flip Chip) — including repassivation and redistribution with fine pitch capability
UltraCSP (Chip Scale Package) — Including repassivation and redistribution
Polymer Collar — Polymer reinforcement layer for high reliability CSP applications (eutectic and lead free)
Solder Alloys — Eutectic, Lead Free, and High Lead

For more information see the License Presentation or contact:
Ted Tessier
Chief Technical Officer
(602) 431-4764
ted.tessier@flipchip.com