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    • Electroplated Cu EDC™(various offerings)
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  • Bump Heights ≤ 130um
    • SFC - Bump on I/O
    • SFC - Repassivation (Spheron™ or BCB)
    • SFC - Redistributions (Spheron™ or BCB)
    • Cu Pillar Bump - Repassivation (Spheron™ )
    • EliteFC™ - Electroless Ni/Au
  • Bump Heights ≥ 160um
    • Spheron™ WLCSP - Bump on I/O
    • Spheron™ WLCSP - Redistribution
    • Electroplated Cu Spheron™ WLCSP
    • UltraCSP® WLCSP - Bump on I/O
    • UltraCSP® WLCSP - Redistribution
    • EliteCSP™ - Electroless Ni/Au
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FlipChip International

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FlipChip International is a world leading WLCSP bumping supplier with 1,000,000+ wafers processed at our Phoenix headquarters since 2005.

Corporate Headquarters

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FlipChip International, LLC

3701 E. University Drive
Phoenix, AZ, USA 85034

Phone: (602) 431-6020

Fax: (602) 437-2739

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