Getting Started
To receive more information on how to get started with FlipChip International, please send your name, company’s name, and contact information to the below “Getting Started” email link. FCI’s knowledgeable Sales team will be able to provide the information and technical guidance necessary to allow you to make a seamless transition into the world of wafer bumping.
Getting Started
Design Guide
FCI’s Sales team will be able to provide you with FlipChip International’s Bumping Design Guide. This Design Guide will help you decide which bumping process offering is best for your device. This comprehensive design guide includes the basics of each process flow, incoming wafer requirements, device requirements, and material properties, so you may have a better understanding of the FCI bumping process as a whole. FCI’s Sales team will be glad to let you know which process will work best for you. FCI is a development driven engineering organization and we are experts at matching up a standard (or custom) bumping process flow to completely match your needs.
Mask Design Information Form
The Mask Design Information Form – Statement or Work (MDIF-SOW) is an easy to use Excel file that lets you tell FlipChip about your bumping requirements, your dicing requirements, your packaging requirements, and any other special processing requirements that you may have. Please fill this form out and contact FCI’s Sales team at the above Getting Started link. To complete the form, start with the General Information tab and then proceed to all other applicable tabs. Our Sales team will be happy to guide you through the completion of this form and walk you through the process of wafer bumping.
Mask Design Information Form (.xls)