How to Get Started

Design Guide (.pdf): To get started with FCI, you can first take a look at the Bumping Design Guide. The Design Guide will help you decide which bumping process is best for your device. This comprehensive guide includes the basics of each process flow, incoming wafer requirements, device requirements, and material properties, so you may have a better understanding of the FCI bumping process. If you still can't decide, give us a call! We'll be glad let you know which process will work best for you. We are experts at matching up a standard process flow to your device. Keep in mind that we are a development driven engineering organization. For unusual devices, we can often design a custom process flow that will completely meet your needs.
Mask Design Information Form (.xls): The Mask Design Information Form-Statement of Work (MDIF-SOW) is an easy to use Excel file that lets you tell FlipChip about your bumping requirements, your dicing requirements, your packaging requirements, and any other special requirements that you may have. If you are a first time customer or have any questions on the form, please Contact FlipChip. We will be happy to guide you. After completion, your FCI Product Engineer will review the form with you to ensure that all necessary information is obtained.

For information on how to directly contact FlipChip International, contact us.