September 1st 2014, FCI relocated its Tempe Arizona Die Sales operation to its Phoenix Headquarters. All regulatory and QMS (ISO/TS 16949) protocols will remain in place as our customers have come to expect from FCI. Flipchip International remains committed to meeting our customers’ current and future business needs.
Complimenting FlipChip International’s world class Wafer Bumping & WLCSP capabilities, our WAFER BACK-END SERVICES are provided under the rigorous quality standards of ISO9001 / TS16949. FCI is also ISO 14001 certified. Supporting AUTOMOTIVE, COMMERCIAL, CONSUMER, INDUSTRIAL, MEDICAL, and MIL/AERO markets, FCI is expert with bumped & non-bumped wafers: ASIC and ASSP, Microcontrollers, Linear and Logic, Precision and Standard Analog, Memory, Power Discrete, optical and image sensors, Low K wafers, and MEMS devices, among others. Capacity exceeds 5 MILLION DIE per WEEK! Contact us for information on how we can help you with all your wafer, back-end and IC needs.