Process Research and Development
Member of the Process R&D team focusing on material selection, evaluation and process development. Responsible for developing materials, product flows and equipment related to flip chip bumping, WLCSP applications and 3D wafer level packaging technologies.
A Process R&D Engineer will report to the Process R&D Manager. Peers include other members of the R&D Engineering staff. Primary working relationships include Process Engineers, Product Engineers, Quality Engineering and Process/Manufacturing Technicians.
1. Work with the Process R&D team providing expertise and support in the area of polymeric materials and processing.
2. Work with the Product Engineering team to support emerging customer applications in parallel to carrying out internal material development and DOEs.
3. Work with suppliers in selecting materials such as permanent dielectrics, photoresists, and chemistries for use in wafer processing technologies such as WLCSP and Flipchip bumping.
4. Follow FCI Technology Development and Deployment Methodologies to carry out process development activities. Drive process development timelines through the TDDM process using basis program management methodologies.
5. Evaluation and selection of process equipment required for coating, photo patterning and developing dry film and liquid dielectric materials
6. Define process parameters by optimizing the process recipes using DOE methodologies. Knowledge of JMP statistical software is preferred.
7. Write specifications for new process developed.
8. Train colleagues to transfer the process to high volume production.
9. Work to develop intellectual property as an individual contributor and as a team member.
10. Provide ongoing support to Process Engineering, Product Engineering, Quality and Operations related to trouble- shooting dielectric and photoresist materials and other thin film processes used in FCI. Assist in investigation and in root cause analysis of Process Deviations as required.
11. Present technical results obtained by presentation and in writing to FCI personnel including senior management and key customers.
12. Work with Product Engineering and with key customers to incorporate new or improved methods or processes to existing technologies or process flows within FCI.
13. The ability to stand/sit for long periods, in and outside of a fab environment.
Education: Minimum of an Engineering degree in Mechanical or Chemical Engineering or a Bachelor of Science degree with Chemistry and relevant job related experience in a wafer bumping or semiconductor wafer fabrication environment.
Job Related Experience: A minimum of 3 to 5 of hands-on process engineering experience in wafer bumping, wafer fabrication or advanced packaging involving process development and optimization of thin films. Demonstrated ability to interact and work with customers and suppliers. Ability/required clearance to support ITAR (International Traffic in Arms Regulations) candidate preferred.