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Analytical Laboratory

Located within the Phoenix Arizona facility is the FCI Reliability & Design Center for Wafer Level Packaging and Flip Chip Bumping Technologies. The center supports in-house testing for its internal and external customers' needs for accelerated tests and analytical analysis. The Center allows FCI to support its customer's designs from concept to product qualification to sustaining ongoing production.

The Center performs services in the following categories:

• Product Qualification
• Reliability (REL) Testing
• Failure Analysis (FA)
• Material Characterization
• Technical/Expert Reports

The Reliability Center is configured with accelerated test equipment to perform both Board level and Wafer level testing using JEDEC standards.

Testing performed includes:

• State-of-the-art Electromigration Testing
• High Temperature Storage
• Temperature Cycling
• Autoclave
• Multiple Reflow
• Drop Test
• Vibration Test

The analytical analysis capabilities include:

• State-of-the-art SEM/EDX, with 12" Chamber
• Optical Inspection
• X-Ray Inspection
• Cross Sectioning
• Planar Sectioning
• Chemical Lab
• Advanced Polymers Lab
• Interface Analysis
• FTIR
• DSC
• UV-VIS (for material characterization)
• Wet Lab

For information on services, please contact:
Ted Tessier, CTO
FlipChip International, LLC
3701 E. University Drive
Phoenix, Arizona, USA, 85034
Phone: +1 (602) 431-4764
ted.tessier@flipchip.com