Analytic
Reliability Engineering Laboratory
FlipChip International, LLC (FCI) offers an in house reliability engineering laboratory and service with more than 14 years of Flip Chip and Wafer Level Chip Scale Packaging (WLCSP) bumping related experience. FCI provides these characterization and analytical capabilities to support our bumping customers needs for accelerated product qualifications as well as to support our Research and Development and Manufacturing needs.
FCI supports a wide range of standardized wafer level and die level reliability tests including Moisture Sensitivity Level (MSL) preconditioning, component level high temperature storage at 150 or 175oC, multiple reflow and pressure cooker testing. These tests are effective in confirming the integrity of bumping technologies in our customer’s non-standard applications. Standard ball or bump shear testing, as well as cross-sectioning and Scanning Electron Microscopic (SEM) structural analysis with Energy Dispersive Spectroscopy (EDS) capabilities is used to compare stressed and unstressed bumped devices. Predicting mechanical robustness at the component level is becoming increasingly important to the industry with the proliferation of handheld electronic assemblies. FCI offers High Speed Shear and High Speed Cold Ball Pull testing capabilities to enable comparative assessments of the mechanical reliability of our tailored bumping solutions versus FCI’s established bumping baselines.
As the importance of mechanical shock robustness of WLCSPs used in portable handheld electronics has become increasingly important, FCI’s Reliability Engineering organization has emerged as an industry leader in board level reliability testing. Through its internal drop testing capabilities and selected PWB fabrication and board assembly partners, FCI can provide its customers highly efficient, full turnkey WLCSP board level drop testing services from custom board design through drop testing and failure mode analysis. FCI supports JEDEC drop testing methodologies and is also a Nokia approved drop test service provider for WLCSPs. Additionally, FCI offers board level thermal cycling and capabilities that can be tailored to meet our customer’s individual requirements.
FCI has at its disposal an internal chemical and material analysis capability that supports the manufacturing efforts of our Phoenix manufacturing facility as well as servicing the needs of our joint venture partners and customers. These capabilities include a full thermal analysis capability (TGA, DSC, TMA), FT-IR, UV-Visible and Atomic Absorption Spectroscopy. With this range of analytical capabilities FCI can provide our customers with unparalleled engineering support.
With our breadth of wafer bumping and WLCSP product engineering expertise, FCI can help reduce the risk and shorten the time to market for our customers driving towards form factor reduction and functional integration gains..... Miniaturization through Innovation.