FCI in the News

Hermes European Embedded Die Consortia Selects FlipChip International's EDC TM Technology
July 8, 2008
Hermes, the European consortia for the development and industrialization of embedded die technology has announced FlipChip International, LLC as an associate partner…
Unisem and FlipChip International Sign Licensing Agreement For Wafer Bumping and Wafer Level Packaging Technologies
June 16, 2008
Partnership with UAT Allows FCI to Extend Its Reach to the Asian Markets. Unisem (M) Berhad (Unisem) and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) announced today that they have entered into an agreement with FlipChip International, LLC (FCI) for the licensing of FCI's wafer bumping and wafer level packaging technologies…
FlipChip International’s EDC™ Enables Embedded Die Packaging
November 14 , 2007
FlipChip International today announced the introduction of its new EDC™, Embeddable Die Customization™ technology targeted at readying integrated circuits…
FlipChip International Announces Expansion of DSD Fab to 3 Million Die Weekly Capacity
November 13 , 2007
FlipChip International, LLC (FCI) announced the completion of its first phase expansion in Q4 2007 of its Die Sales Division (DSD) fab in Tempe, AZ.…
FlipChip International Appoints David McComb Vice President Sales and Marketing
September 24, 2007
FlipChip International, LLC, announced today that it has appointed David McComb as Global Vice President Sales and Marketing for its semiconductor wafer scale packaging and bumping business…
FlipChip International and White Mountain Labs Announce Turnkey Business Offering
September 10, 2007
FlipChip International (FCI), the leading merchant flip chip and wafer level package provider, and White Mountain Labs (WML)…
FlipChip International Appoints Scott T. Barrett Vice President Asian Business Development
August 7, 2007
FlipChip International announced today that it has appointed Scott T. Barrett as Vice President, Asian Business Development, for its semiconductor wafer scale packaging and bumping business in Phoenix, Arizona, and its FCMS joint venture in Shanghai, China…
FlipChip International Appoints Dave Dixon as FCI's Bump Director of Operations
July 16, 2007
FlipChip International announced today that it has appointed Dave Dixon as Bump Fab Director of Operations for its semiconductor wafer scale packaging and bumping business in Phoenix, Arizona…
FlipChip International Appoints Marcus Crayon Vice President of Quality
February 12, 2007
FlipChip International announced today that it has appointed Marcus Crayon Vice President of Quality…
FlipChip International Receives ISO 14001:2004 Certification
February 1, 2007
FlipChip International announced today that it has received ISO 14001:2004 certification from their registrar SGS…
FlipChip International Appoints Greg Marshall as Chief Financial Officer
December 20, 2006
FlipChip International announced today that it has appointed Greg Marshall as Chief Financial Officer and VP of Finance for its semiconductor wafer scale packaging and bumping business in Phoenix, Arizona…
FlipChip International Successfully Completes ISO 14001 Conformance Audit
November 30, 2006
FlipChip International announced today that it has successfully completed the Stage 2 EMS conformance audit for ISO 14001-2004…
RoseStreet Labs and Sumitomo Chemical Announce Joint Venture for Full Spectrum Solar Cells
November 22, 2006
RoseStreet Labs, LLC, and Sumitomo Chemical Co. Ltd. (Sumitomo) today announced a joint venture, RSL Energy, Inc., for the development and manufacturing of full spectrum solar cells…
FlipChip International Announces Enhanced Lead Free Technology for Major Improvements in WLCSP Drop Test Performance
October 6, 2006
FlipChip International LLC announced today that is has demonstrated a near 10x breakthrough in reliability relative to the JEDEC JESD22-B111 Drop Test Specification for Wafer Level Chip Scale Packaging (WLCSP)…
FlipChip International Announces the Appointment of Ted Tessier as Chief Technical Officer
June 28, 2006
FlipChip International LLC announced today that it has appointed Ted Tessier as Chief Technical Officer for its semiconductor wafer scale packaging and bumping business in Phoenix, Arizona. …
FlipChip International Announces the Appointment of Jay Grover as Chief Operations Officer
June 28, 2006
FlipChip International LLC announced today that it has appointed Jay Grover as Chief Operations Officer for its semiconductor wafer scale packaging and bumping business in Phoenix, Arizona. …
FlipChip International Announces the Appointment of Fred Hickman as Vice President of Sales and Marketing
January 6, 2006
FlipChip International LLC announced today that it has appointed Fred Hickman III as Vice President of Sales and Marketing for its semiconductor wafer scale packaging and bumping business in Phoenix, Arizona. …
FlipChip International Announces the Appointment of Ted Tessier as Senior Vice President of Engineering
December 15, 2005
FlipChip International LLC announced today that it has appointed Ted Tessier as its Sr. Vice President of Engineering for its semiconductor wafer scale packaging and bumping business in Phoenix, Arizona. …
FlipChip International Announces Record High Monthly Volumes in Wafer Level Packaging
November 14, 2005
FlipChip International today announced record revenues in October, 2005 following 18 months of strong growth and representing a 35% increase in wafer level packaging volume over 2004…
ASE and FlipChip International Sign Worldwide Licensing Agreement
April 28, 2005
License enables global implementation of wafer bumping technology and UltraCSP wafer-level packaging technology…
FlipChip International Introduces EliteCSP™ Wafer Level Package and License with Fraunhofer Institute for Advanced Low Cost Wafer Bumping.
April. 26, 2005
FlipChip International today announced the introduction of its new EliteCSP™ product for wafer level packaging and wafer bumping…
Flipchip International And Nec Electronics Sign Cross-Licensing Agreement For Advanced Wafer Level Packaging Technology
April 20, 2005
FlipChip International and NEC Electronics today announced that the two companies have entered into an extensive patent cross-licensing agreement for advanced wafer level packaging, flip chip bumping, solder bump reinforcement and wafer applied underfill technologies…
Flipchip International Announces Successful Completion Of Acquisition Of Assets Of IC Services
January 25, 2005
FlipChip International, LLC today announced the successful completion of its acquisition of substantially all of the assets of IC Services, Inc. IC Services assets include substantial dicing, automated inspection, backgrind and tape/reel capabilities…
Flip Chip International Appoints Terrence M. Lubsen as VP – Quality & Continuous Improvement
March 23, 2004
FlipChip International LLC announced today that it has appointed Terrence M. Lubsen as its Vice President of Quality and Continuous Improvement for its semiconductor wafer scale packaging and bumping business in Phoenix, Arizona…