The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels.
People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
Featuring 3 Topical Workshop Tracks:
• 3D Integration
• Flip Chip, Wafer Level Packaging & Fan-Out
• Advanced Packaging and Emerging Materials for Automotive, 5G, and Next Gen Applications
Stop by and say hello!