Today TianShui Huatian Technology Co., LTD (TSHT – 002185:Shenzhen) announced to the Shenzhen Stock Exchange their intention to acquire 100% of FlipChip International LLC and its subsidiaries. A binding Letter Of Intent has been agreed by the Boards of both companies. The definitive agreement is due to be signed mid-December and shall be approved by or filed with the relevant US and Chinese regulatory authorities. We expect the transaction to close in mid-February 2015.
TianShui Huatian Technology Co., LTD is the second largest Chinese provider of IC Testing and Packaging for Semiconductor IC and components. The acquisition of FlipChip International LLC, the global technology leader in Flip Chip bumping and Wafer Level Packaging, adds a broad range of advanced wafer level packaging technologies, highlighting world-class service, quality, and reliability on a global basis to the TSHT strong product portfolio. The combined product lines of TSHT and FCI will offer a complete range of Semiconductor products and turnkey services to meet your needs on a worldwide basis.
Operationally it will be business as usual for our FCI customers. We will communicate any changes that may occur to you as timely as possible, but for the foreseeable future, we request that you continue to do business using your current contacts and processes for FCI products.
We remain committed to providing you with outstanding customer service, advanced technology solutions, and world-class quality and manufacturing. We look forward to a continuing, long and mutually beneficial relationship.