FlipChip International is the leading provider of merchant Wafer Level Packaging (WLP) and flip chip bumping to the semiconductor market through its Phoenix Arizona facility and five global licensees. Services provided include: Standard Flip Chip (SFC, formally known as Flex-on-Cap™), Redistributed SFC, Wafer UltraCSP™, Spheron™ (High Frequency RF Packaging), EliteCSP™ (a low cost E-less Nickel bumping WLCSP), and Polymer Collar™. FlipChip provides turn-key wafer bumping services from engineering prototypes to high volume manufacturing.

FlipChip International, Die Sales Division provides semiconductor wafer back-end services including: Dicing, Optical Inspection, Pick-and-Place, Waffle-Pak, and Tape & Reel. DSD specializes in Known Good Die (KGD), Zero Defects (ZD), Automatic Optical Inspection (AOI), Wafer Sawing, Wafer Probe, Wafer Sort, Test, Die Trays, Quick Turns, and Ship Direct of finished die.